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Sharky Extreme :


Latest News


- NZXT Unleashes the Sentry LX High-Performance Fan Controller
- OCZ Announces the Core Series of SATA II Solid State Drives
- Asetek Introduces the First Liquid-Cooling System for the Radeon HD 4870
- AMD Exhumes the All-in-Wonder Brand Name
- AMD Hits a New Performance High with the ATI Radeon HD 4800
News Archives

Features

- SharkyExtreme.com: Interview with Microsoft's Dan Odell
- SharkyExtreme.com: Interview with ATI's Terry Makedon
- SharkyExtreme.com: Interview with Seagate's Joni Clark
- Half-Life 2 Review
- DOOM 3 Review

Buyer's Guides

- May Value Gaming PC Buyer's Guide
- March Extreme Gaming PC Buyer's Guide
- January High-end Gaming PC Buyer's Guide

HARDWARE

  • CPUs

    - AMD Phenom X4 9950 BE & 9350e Review
    - AMD Phenom X3 8750 Review

  • Motherboards

    - AMD 780G Chipset Review

  • Video Cards

    - PNY XLR8 GeForce 9800 GX2 1GB Review
    - Gigabyte Radeon HD 3870 512MB Review
    - ASUS EN8800GT TOP 512MB Review




  • Pentium III Processor Core
  • 256KB Advanced Transfer Cache On-Die (ATC)
    • 8-way set associative, 1024 sets
    • 32 byte line (32 bytes data, 4 bytes ECC) every 2 clocks, equals 11.7GB/sec throughput at 733MHz
    • 36-bit physical address space
    • 4 x reduction in latency versus Katmai P3 L2
    • Cache bus speed fully scalable with core frequency
    • 288-bit transfer width (256 data, 32 ECC)
    • 2 cycle back to back throughput
  • Advanced System Buffering (ASB)
    • 6 Fill Buffers (increased from 4) offer increase of 50% in concurrent non-blocking data cache operations.
    • 8 Bus Queue Entries (increased from 4) allow more outstanding memory/bus operations.
    • 4 Writeback Buffers (increased from 1) offer reduced blocking during cache replacement operations along with faster deallocation time for fill buffers.
  • .18um Manufacturing Process
    • Decrease in minimum gate dimension for improved transistor speed.
    • Fluorine-doped SiO2 (SiOF) dielectric for reduced capacitance resulting in global speed increase.
  • 6 Metal Layer Process
    • Additional metal layer for routing density enables full-speed integrated L2 interface.
  • 28 Million Transistors
  • 106mm2 Die Size
  • 1.1v - 1.7v Operation
  • On-Die GTL+ Termination

    As the specs show, the Coppermine core offers a host of smaller improvements, along with the packaging of the L2 cache on-die and faster front side bus speed (133MHz) support.

    These additions will make themselves felt more early next year when recompiled SSE optimization routines are introduced to existing and new software via DirectX7, Intel's own Fortran95 Compiler 4.5, and Intel's C/C++ Compiler 4.5.





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